Talk:Integrated circuit packaging

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Wiki Education Foundation-supported course assignment

This article is or was the subject of a Wiki Education Foundation-supported course assignment. Further details are available on the course page. Student editor(s): DerikWP.

Above undated message substituted from Template:Dashboard.wikiedu.org assignment by PrimeBOT (talk) 00:35, 17 January 2022 (UTC)[reply]

Standards body

A reference to the main standards organizations for packages would be helpful. JEDEC comes to mind. Are there others? In particular, it would be useful with a link to the actual standards.

Perhaps some popular packages are industry standards, rather than official standards. That should also be apparent in this article and articles about each particular package type. --HelgeStenstrom 12:44, 18 September 2007 (UTC)[reply]

Title

I would suggest changing the title from Integrated circuit packaging to Packaging_(microfabrication). This would allow us more general description of packages used for integrated circuits and microsystems. As some techniques from Integrated circuit packaging are used also in packages for MEMS, we could use more general title like Packaging_(microfabrication) to cover both topics IC and MEMS in one article. We could redirect Integrated circuit packaging to this more general site. What do you think? Twisp (talk) 23:39, 2 March 2008 (UTC)[reply]

I made a REDIRECT from Packaging_(microfabrication) to this article (Integrated circuit packaging). Sparkie82 (t•c) 02:03, 6 December 2012 (UTC)[reply]

Rewrite

The article needs a rewrite. Do not rely on it. History2007 (talk) 22:15, 18 May 2012 (UTC)[reply]

I rewrote the lead to make it more accessible and readable. The rest of the article still needs to be checked for factual accuracy (and properly sourced). Sparkie82 (t•c) 02:03, 6 December 2012 (UTC)[reply]

Article Expansion and Cleanup

Howdy folks,

I'm a student editor in a wikied course. I've selected this article to make some improvements to, and I plan to start implementing these updates between April 5-8. Currently, there is a draft of this article in my personal sandbox, if you wish to see what I plan to change. So far, I've renamed, reworked and expanded some of the existing sections, replaced one of the pictures with something more relevant, and added some generalized design considerations for packaging as a whole.

I'm also working on finding and sourcing a lot of the unsourced information currently present on this page.

I may or may not add more sections as necessary.

Free free to let me know if you have any comments or concerns.

DerikWP (talk) 17:07, 1 April 2016 (UTC)[reply]

External links modified

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Intel Leads the Way with Advanced Packaging

Here is an article about Intel Leads the Way with Advanced Packaging. Rjluna2 (talk) 20:46, 7 September 2023 (UTC)[reply]