Talk:Wafer testing

This is the talk page for discussing improvements to the Wafer testing article.
This is not a forum for general discussion of the article's subject.

Put new text under old text. Click here to start a new topic.
New to Wikipedia? Welcome! Learn to edit; get help.

Article policies

Find sources: Google (books · news · scholar · free images · WP refs) · FENS · JSTOR · TWL

Wafer Sort Cost Analysis

Can wafer sort operation skip is a wise step when production yield (Sort yield) is so high ? —Preceding unsigned comment added by 130.86.73.91 (talk • contribs) 18:48, 7 October 2006

Possibly dated information

The article mentions the following: "This wafermap is then sent by a network or floppy disk to the die attachment process" Is that current? because I can't imagine floppies being used. Perhaps someone that has more recent familiarity to production could correct this if needed. Wwhat (talk) 17:33, 10 December 2007 (UTC)[reply]

Undid Merger

The consensus on the merger into Wafer_(electronics) has changed. Since the wafer article has growth, this topic no longer fits within that article and has been moved back into its own page. Dspark76 (talk) 02:49, 24 February 2008 (UTC)[reply]

merge

I suggest merging the wafer prober article (currently a stub) into wafer testing. The tool is so specialized that I think one article can cover both the tool and the what the tool is used for -- like microwaving currently redirects to microwave oven. --68.0.124.33 (talk) 14:04, 29 June 2008 (UTC)[reply]

Consider keeping the wafer prober article but paring it down to the topic at hand; with appropriate references to the broader topics (articles). Rswelker (talk) 18:20, 19 November 2008 (UTC)[reply]

I concur with merging the two articles together, given the short length of each and very specific scope of the articles. By the bye, I will try to add some photos of some wafer testing equipment in the near future.

Ixnayonthetimmay (talk) 08:03, 20 May 2011 (UTC)[reply]

define the ternimology better

In today's high volume IC manufacturing test industry: A "wafer prober" is actually a wafer handler. The term prober comes from Latin "probāre" which means "to test" in English. This part of the equipment does not do any testing of the die but a direct translation from the Latin root would be "tester" so we know it is not a correct use of the word. I believe the term prober was used by equipment OEM marketers to differentiate themselves and is not accurate use of the English language. The tester is a separate piece of equipment that works with the "test board" & "probes" but is "docked" to the wafer handler(what you are calling prober) to actually test the die on the wafer. Again the "wafer prober" does not do any testing of the die it only handles the wafer so the term Prober is a miss-use of the meaning but a great marketing term to differentiate the equipment in the market place. —Preceding unsigned comment added by 137.71.23.54 (talk) 19:59, 11 February 2010 (UTC)[reply]