Bow and warp of semiconductor wafers and substrates
Bow and warp of semiconductor wafers and substrates are measures of the flatness of wafers.
Definitions
[edit]Bow is the deviation of the center point of the median surface of a free, un-clamped wafer from the reference plane, where the reference plane is defined by three corners of an equilateral triangle[clarification needed]. This definition is based on now obsolete ASTM F534.[1]
Warp is the difference between the maximum and the minimum distances of the median surface of a free, un-clamped wafer from the reference plane defined above. This definition follows ASTM F657,[2] and ASTM F1390.[3]
Modifications
[edit]The above definitions were developed for capacitance wafer thickness gauges such as ADE 9500,[4] and later adopted by optical gauges.[5]
Even though these standards are currently obsolete. They were withdrawn without replacement but are still widely used for characterization of semiconductor wafers, metal and glass substrates for MEMS devices, solar cells, and many other applications.[6][7][8]
References
[edit]- ^ "ASTM F534 - 02a Standard Test Method for Bow of Silicon Wafers (Withdrawn 2003)". www.astm.org.
- ^ "ASTM F657 - 92(1999) Standard Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning (Withdrawn 2003)". www.astm.org.
- ^ "ASTM F1390 - 02 Standard Test Method for Measuring Warp on Silicon Wafers by Automated Noncontact Scanning (Withdrawn 2003)". www.astm.org.
- ^ [1][permanent dead link]
- ^ "Optoprofiler". www.zebraoptical.com.
- ^ Semiconductor measurements and instrumentation WR Runyan, 1975 - McGraw-Hill Companies
- ^ "Archived copy" (PDF). Archived from the original (PDF) on 2009-02-20. Retrieved 2009-11-11.
{{cite web}}: CS1 maint: archived copy as title (link) - ^ http://www.iop.org/EJ/abstract/0957-0233/19/2/025302 [dead link]