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180 nm process

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(Redirected from 0.18 process)

The 180 nm process is a MOSFET (CMOS) semiconductor process technology that was commercialized around the 1998–2000 timeframe by leading semiconductor companies, starting with TSMC[1] and Fujitsu,[2] then followed by Sony, Toshiba,[3] Intel, AMD, Texas Instruments and IBM.

History

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The origin of the 180 nm value is historical, as it reflects a trend of 70% scaling every 2–3 years.[citation needed] The naming is formally determined by the International Technology Roadmap for Semiconductors (ITRS).

Some of the first CPUs manufactured with this process include Intel Coppermine family of Pentium III processors. This was the first technology using a gate length shorter than that of light used for contemporary lithography, which had a wavelength of 193 nm.[citation needed]

Some more recent[when?] microprocessors and microcontrollers (e.g. PIC) are using this technology because it is typically low cost and does not require upgrading of existing equipment.[citation needed] In 2022, Google sponsored open-source hardware projects using GlobalFoundries 180nm MCU (microcontroller) process on multi-project wafers.[4]

In 1988, an IBM research team led by Iranian engineer Bijan Davari fabricated a 180 nm dual-gate MOSFET using a CMOS process.[5] The 180 nm CMOS process was later commercialized by TSMC in 1998,[1] and then Fujitsu in 1999.[2]

Processors using 180 nm manufacturing technology

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References

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  1. ^ a b "0.18-micron Technology". TSMC. Retrieved 30 June 2019.
  2. ^ a b 65nm CMOS Process Technology
  3. ^ a b "EMOTION ENGINE AND GRAPHICS SYNTHESIZER USED IN THE CORE OF PLAYSTATION BECOME ONE CHIP" (PDF). Sony. April 21, 2003. Retrieved 26 June 2019.
  4. ^ "Google funds open source silicon manufacturing shuttles for GlobalFoundries PDK". Google Open Source Blog. Retrieved 2022-11-16.
  5. ^ Davari, Bijan; et al. (1988). "A high performance 0.25 mu m CMOS technology". Technical Digest., International Electron Devices Meeting. pp. 56–59. doi:10.1109/IEDM.1988.32749. S2CID 114078857.
Preceded by
250 nm
CMOS manufacturing processes Succeeded by
130 nm