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Summary

Description
English: Different types of vias in PCBs (1 through hole, 2 blind via, 3 buried via)
Français : Différents types de vias dans un circuit imprimé multicouches (1 : trou traversant, 2 : trou borgne, 3 : trou enterré)
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Author M adler
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7 March 2008

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Date/TimeThumbnailDimensionsUserComment
current18:22, 20 March 2008Thumbnail for version as of 18:22, 20 March 2008325 × 235 (17 KB)M adler {{Information |Description=Different types of vias in PCBs (1 through hole, 2 blind via, 3 buried via) |Source=selfmade (arrow updated) |Date=20.03.2008 |Author=madler ~~~~ |Permission=GFDL, CC-BY 3.0 |other_versions= }}
23:03, 7 March 2008Thumbnail for version as of 23:03, 7 March 2008325 × 231 (16 KB)M adler{{Information |Description=Different types of vias in PCBs |Source=self-made |Date=07 March 2008 |Author= M adler |Permission=GFDL, CC-BY 3.0 |other_versions= }}

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