File:IBM SLT wafers.agr.JPG
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Summary
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| Description |
English: Steps in manufacturing Solid Logic Technology hybrid wafers used in the w:IBM System/360 and other IBM computers of that era, starting in 1964. The process starts with a blank ceramic wafer 1/2 inch square (1). Circuits are laid down first (2), followed by resistive material (3). Pins are added (4), the pins and circuits are soldered (5) and the resistors trimmed to the desired value (6). Then individual transistors and diodes are added (7) and the package encapsulated (8). Display at the Computer History Museum. "Gift of Mike Turin" [1] |
| Date | |
| Source | Own work |
| Author | ArnoldReinhold |
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 19:15, 10 February 2012 | | 3,221 × 397 (453 KB) | ArnoldReinhold |
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