File:B-d-diagramsurfaceenergy.png
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Summary
| Description |
English: Surface energy diagram of hydrophilic and hydrophobic bonded wafers. |
| Date | |
| Source | A. Plössl and G. Kräuter, Wafer direct bonding: tailoring adhesion between brittle materials Materials Science and Engineering (1999) |
| Author | Uploaded by Enaswiki at en.wikipedia |
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Upload date | User | Bytes | Dimensions | Comment
- 2011-03-29 18:41 (UTC) | Enaswiki | 332176 (bytes) | 2477×2114 | {{Information |Description = Diagram of the surface energy of hydrophilic and hydrophobic bonded wafers |Source = Q.-Y. Tong and U. Gösele, Semiconductor Wafer Bonding: Science and Technology (1998) |Date = ~~~~~ |Author
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 12:25, 27 December 2011 | | 2,477 × 2,114 (324 KB) | SreeBot | (Original text) : {{Information |Description = Diagram of the surface energy of hydrophilic and hydrophobic bonded wafers |Source = Q.-Y. Tong and U. Gösele, Semiconductor Wafer Bonding: Science and Technology (1998) |Date = ~~~~~ |
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