File:B-ad-crosssectionbcb.png
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Summary
| Description |
English: Cross-sectional view of bonded wafer pair with an intermediate BCB layer width of 100 µm |
| Date | (UTC) |
| Source | M. Wiemer and C. Jia and M. Töpper and K. Hauck, Wafer Bonding with BCB and SU-8 for MEMS Packaging (2006) |
| Author | Fraunhofer ENAS, D. Neumann |
Licensing
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Original upload log
Transferred from en.wikipedia to Commons by Josve05a using CommonsHelper.
The original description page was here. All following user names refer to en.wikipedia.
- 2011-03-30 11:17 Enaswiki 3476×2805× (1516697 bytes) {{Information |Description = Cross-sectional view of bonded wafer pair with an intermediate BCB layer width of 100 µm |Source = M. Wiemer and C. Jia and M. Töpper and K. Hauck, Wafer Bonding with BCB and SU-8 for MEMS Packaging (2006)
File history
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 09:11, 3 September 2011 | | 3,476 × 2,805 (1.45 MB) | File Upload Bot (Magnus Manske) | {{BotMoveToCommons|en.wikipedia|year={{subst:CURRENTYEAR}}|month={{subst:CURRENTMONTHNAME}}|day={{subst:CURRENTDAY}}}} {{Information |Description={{en|Cross-sectional view of bonded wafer pair with an intermediate BCB layer width of 100 µm}} |Sourc |
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