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Description Schematic process flow of dry etch and photosensitive BCB wafer bonding technique.
Date (UTC)
Source J. Oberhammer and F. Niklaus and G. Stemme, Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities (2003)
Author Fraunhofer ENAS, D. Neumann
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Attribution: Fraunhofer ENAS
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30 March 2011

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Date/TimeThumbnailDimensionsUserComment
current10:56, 30 March 2011Thumbnail for version as of 10:56, 30 March 2011679 × 847 (20 KB)Enaswiki
10:52, 30 March 2011Thumbnail for version as of 10:52, 30 March 2011679 × 847 (19 KB)Enaswiki Category:Wafer bonding Category:Adhesive bonding
18:10, 28 March 2011Thumbnail for version as of 18:10, 28 March 2011667 × 862 (14 KB)Enaswiki{{Information |Description ={{en|1=Schematic process flow of dry-etch and photosenstivie BCB wafer bonding technique.}} |Source =Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities |Author =Oberhamme

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